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Chip Fabrication

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In the chip manufacturing industry, ultrapure water is known as the "blood" of the industry. It is used throughout all core chip manufacturing processes, including silicon wafer cleaning, photoresist coating and development, wet etching, and chemical mechanical polishing (CMP).

These processes place extremely stringent demands on water quality; even the slightest impurity can cause chip fluid failure.

Among many water quality parameters, total organic carbon (TOC) is a key indicator of the degree of organic contamination in ultrapure water. The presence of TOC, even at extremely low levels of ppb (parts per billion) or even ppt (parts per trillion), can seriously impact the quality of delicate semiconductor devices.

Vacuum ultraviolet (VUV) technology, an advanced, chemical-free method for TOC degradation, uses high-energy ultraviolet light directly on water or organic matter in it, generating strong oxidizing free radicals that break down the organic matter into harmless small molecules.

Low-pressure mercury lamps are the primary VUV light source used in current industrial applications, with 185nm VUV light being the primary contributor to TOC degradation.

VUV light (185nm) can directly photolyze water molecules, generating hydroxyl radicals (·OH) in situ. ·OH is a highly reactive species with strong oxidizing power, capable of non-selectively oxidizing and degrading most organic pollutants in water. This process, when used in pure VUV photolysis, eliminates the need for additional chemical reagents, thus avoiding the risk of secondary contamination. This is particularly important for the preparation of ultrapure water.

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The target for controlling TOC in ultrapure water is typically less than 1 ppb (ug/L).

Advanced processes even require limits below 0.5 ppb or even ppt (ng/L).

· Position in the UPW system:

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Typical ultrapure water process flow chart

Advanced Treatment of Small-Molecular Organic Compounds

The UV/H₂O₂ Advanced Oxidation Process (UV/H₂O₂ AOP) is a highly efficient, non-selective advanced treatment technology for the removal of residual small-molecule organic compounds from reverse osmosis (RO) effluent.

•OH Radical Non-Selective Attack

The core of the UV/H₂O₂ process is that under 185 nm or 254 nm UV light, H₂O₂ undergoes homolytic cleavage to produce hydroxyl radicals (•OH). These radicals react with the C–H, C=C, and C≡C bonds of small-molecule organic compounds, continuously oxidizing small-molecule organic compounds (<350 Da, such as methanol, urea, oxalic acid, PPCPs, and EDCs) that are not retained by RO, ultimately mineralizing them into CO₂ and H₂O.


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Related Products

EX-UPW-TOC紫外

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EX-UPW-TOC产品系列是一款适用于超纯水(UPW)制备中对总有机碳(TOC)进行降解的先进可靠系统。通过更高185nm穿透率、实时在线的紫外线强度监测、本地/远程的智能控制，实现高效、安全可控的总有机碳 (TOC)降解。该设备在超纯水制备工艺中，可使超纯水TOC降至1ppb以下。


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 CLEAR中压紫外

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ONYX-Clear-SY管道式中压紫外消毒器，采用中压紫外灯的物理杀菌，不添加任何化学物，无二次污染。具有安全运行、操作简便、更低的运营成本和维护频次。

处理后的水不影响口感风味。符合《中华人民共和国食品安全法》、《生活饮用水卫生标准》（GB 5749）、《饮用净水水质标准》（CJ94-2005）、《食品安全国家标准 饮用天然矿泉水》(GB 8537-2018)和《包装饮用水》（DGB19298-2014）等用水标准。

 光解

光解

紫外光解通常是指利用紫外线（UV）照射来分解物质（尤其是污染物）的技术。

某些物质（特别是有机污染物）的分子键能被特定波长的紫外线（通常是短波长的 UV-C，如 254 nm）直接打断，发生裂解反应，分解成更小的分子、自由基或最终矿化为 CO₂ 和 H₂O，这被称为直接光解。主要可用于超纯水去除TOC、纯化水RO膜前余氯脱除及消毒、游泳池与水景中氯铵分解及消毒。

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